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HSB01-080808-Same Sky (Formerly CUI Devices)-HEAT SINK, BGA, 8.5 X 8.5 X 8 MM — image 1
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Same Sky (Formerly CUI Devices)

HSB01-080808-Same Sky (Formerly CUI Devices)-HEAT SINK, BGA, 8.5 X 8.5 X 8 MM

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Solid Metal Heat Sink for everyday users

The HSB01-080808-Same Sky (Formerly CUI Devices)-HEAT SINK, BGA, 8.5 X 8.5 X 8 MM by Same Sky (Formerly CUI Devices) is a value-for-money solid metal heat sink designed for everyday users. It features Manufacturer: Same Sky (Formerly CUI Devices) and Case/Package: BGA.

₹620
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Total: ₹620
Buying tip: A smart budget buy — solid performance without breaking the bank.
Estimated delivery: 17 Aug31 Aug
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Quick Specs

Manufacturer: Same Sky (Formerly CUI Devices)
Case/Package: BGA
Mounting Type: Top Mount
Shape: Square, Pin Fins
Length (mm): 8.50
Width (mm): 8.50

Ideal For

Everyday convenience
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SKU: robu-2791832Category: Solid Metal Heat Sink

About This Product

The HSB01-080808-Same Sky (Formerly CUI Devices)-HEAT SINK, BGA, 8.5 X 8.5 X 8 MM by Same Sky (Formerly CUI Devices) is a value-for-money solid metal heat sink designed for everyday users. It delivers reliable performance at an accessible price.

Key Specifications

  • Manufacturer: Same Sky (Formerly CUI Devices)
  • Case/Package: BGA
  • Mounting Type: Top Mount
  • Shape: Square, Pin Fins
  • Length (mm): 8.50
  • Width (mm): 8.50
  • Fin Height(mm): 8.00
  • Material: Aluminum Alloy — built to last with a quality finish

Why Buy from Pricio?

Pricio sources this product directly, cutting out multiple middlemen. Every order includes free shipping, a 15-day return policy, and secure payment via Razorpay.

HSB01-080808-Same Sky (Formerly CUI Devices)-HEAT SINK, BGA, 8.5 X 8.5 X 8 MM. This heatsink is well-suited for use in compact devices, embedded systems, and other electronics requiring reliable and efficient cooling in limited board space. Images for reference only.

Specifications: 

  1. Type: Top Mount
  2. Package Cooled: BGA
  3. Attachment Method: Adhesive (Not Included)
  4. Shape: Square, Pin Fins
  5. Length: 0.335" (8.50mm)
  6. Width: 0.335" (8.50mm)
  7. Fin Height: 0.315" (8.00mm)
  8. Power Dissipation @ Temperature Rise: 1.9W @ 75°C
  9. Thermal Resistance @ Forced Air Flow: 16.00°C/W @ 200 LFM
  10. Thermal Resistance @ Natural: 39.10°C/W
  For more detail refer to the datasheet in Attachments. 

Package Includes:

1 x HSB01-080808-Same Sky (Formerly CUI Devices)-HEAT SINK, BGA, 8.5 X 8.5 X 8 MM